MIL-DTL-47113C
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时间:2024-05-17 23:38:10
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MIL-DTL-47113C, DETAIL SPECIFICATION: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE (12 APR 1999) [SUPERSEDING MIL-C-47113B]., This specification covers a silicone or non-silicone heat sink compoundwhich is applied to the base and mounting studs of transistors and diodes to provide a positiveheat sink seal.
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